Resin molded type semiconductor device having a conductor film

Details Resin molded type semiconductor device having a conductor film Resin molded type semiconductor device having a conductor film

1993-06-07

1994-12-06

Carroll, J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257207, 257637, 257642, 257691, 257739, 257787, H01L 2702, H01L 2934, H01L 2348, H01L 2944

Patent

active

053714113

ABSTRACT:
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

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