Resin-molded type semiconductor device and method of manufacturi

Details Resin-molded type semiconductor device and method of manufacturi Resin-molded type semiconductor device and method of manufacturi

1996-03-25

1998-05-26

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257666, 257787, H01L 23495

Patent

active

057570663

ABSTRACT:
A resin sealed semiconductor device, wherein support pins uphold a pair of facing sides of the semiconductor chip. A projected portion is formed on the distal end portion of the support pin in proximate to the semiconductor chip. The projected portion is formed on both sides of the supporting members which respectively correspond to an upper side and a bottom side of the semiconductor chip in such a manner that when the projected portions are viewed from the upper side or bottom side of the semiconductor chip, they overlap with each other. All of the height of the projected portions are the same. The thickness of the resins formed on both opposite sides of the semiconductor chip is the same with each other, thus preventing the upward or downward displacement within the sealing resin of the semiconductor chip in a thin package.

REFERENCES:
patent: 5635756 (1997-06-01), Kohno et al.

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