Resin molded semiconductor device and mold

Details Resin molded semiconductor device and mold Resin molded semiconductor device and mold

2005-09-27

2008-11-11

Davis, Robert B (Department: 1791)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

Reexamination Certificate

active

07448861

ABSTRACT:
To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink11having a one-dimensional CCD element14mounted thereon. The thermal coefficient of expansion of the heat sink21is matched with that of a hollow molded case12for integrally molding the heat sink11and a lead frame20. A plurality of projections21formed on the side of the hollow molded case12are disposed at a bonding interface between the glass cap13which closes an upper opening of the hollow molded case12and side walls of hollow molded case12.

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Japanese Office Action dated Jan. 28, 2008 with partial English Translation.

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