Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-08-16
2011-08-16
Cao, Phat X (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C257SE21504
Reexamination Certificate
active
07998794
ABSTRACT:
This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion from occurring due to burrs on a lead frame formed by punching. The method of manufacturing the resin molded semiconductor device according to the invention includes bonding a semiconductor die on an island in a lead frame, electrically connecting the semiconductor die with the lead frame, resin-molding the lead frame on which the semiconductor die is bonded, and applying prior to the resin-molding a compressive pressure that is higher than a clamping pressure applied in the resin-molding to a region of the lead frame being clamped by molds in the resin-molding of the lead frame.
REFERENCES:
patent: 4942455 (1990-07-01), Shinohara
patent: 2008/0191328 (2008-08-01), Kobayakawa
Handotai Shingijutsu Kenkyukai ed. (2007) “Function and aim of semiconductor package” inAll About Leading Edge Packaging Technologies—With Illustrations. Kogyo Chosakai Publishing Co., Ltd. (3 pages).
Saito Kiyoshi
Umetani Yuji
Yoshimi Hideaki
Cao Phat X
Doan Nga
Morrison & Foerster / LLP
Sanyo Electric Co,. Ltd.
Sanyo Semiconductor Co. Ltd.
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