Resin-molded semiconductor device and a process for manufacturin

Details Resin-molded semiconductor device and a process for manufacturin Resin-molded semiconductor device and a process for manufacturin

1983-12-19

1985-09-10

Smith, John D.

Coating processes

Electrical product produced

Condenser or capacitor

427240, H01L 2330

Patent

active

045406030

ABSTRACT:
A process for manufacturing resin-molded semiconductor devices which are sealed in an epoxy resin is carried out without employing a metal mold. In the process, an epoxy resin is deposited on a sub-assembly consisting of a semiconductor pellet brazed to axial leads while turning the sub-assembly with the axial leads as a center so that the epoxy resin is applied to a predetermined shape; then the epoxy resin is heated at an elevated temperature while turning the sub-assembly so that surface portions of the epoxy resin are hardened and the epoxy resin is further heated at an elevated temperature without turning the sub-assembly so that the epoxy resin is completely hardened.

REFERENCES:
patent: 3492157 (1970-01-01), Ito et al.
patent: 3958039 (1976-05-01), Yabuki
patent: 4282136 (1981-08-01), Hunt

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