Resin-molded package with cavity structure

Details Resin-molded package with cavity structure Resin-molded package with cavity structure

2006-02-28

2006-02-28

Mohandesi, Jila M. (Department: 3728)

Special receptacle or package

Holder for a removable electrical component

For a semiconductor wafer

C206S832000, C206S724000

Reexamination Certificate

active

07004325

ABSTRACT:
A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap deeming a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

REFERENCES:
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patent: 1 096 563 (2001-05-01), None
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patent: 3127584 (2000-11-01), None
patent: 2000006598 (2000-02-01), None

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