Resin-molded electronic circuit device

Details Resin-molded electronic circuit device Resin-molded electronic circuit device

1996-05-16

1999-06-08

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 525, 361784, 361785, H05K 330, H05K 111, H01R 2368

Patent

active

059099151

ABSTRACT:
A resin-molded electronic circuit device is provided with a protection resin molded with covering electronic components and an electronic circuit substrate and having almost the same coefficient of thermal expansion as that of a metal forming the electronic components and the electronic circuit substrate, and a connector mounted at an end of the protection resin and functioning as an external connecting terminal of the electronic circuit substrate. Since a case for housing the protection resin is unnecessary, it is possible to decrease the number of components and man-hours, and enhance the outside appearance of the electronic circuit device.

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patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5424251 (1995-06-01), Sono et al.

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