Resin molded article and molding method thereof

Details Resin molded article and molding method thereof Resin molded article and molding method thereof

2011-07-12

2011-07-12

Watkins, III, William P (Department: 1783)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

C428S156000, C428S158000, C264S045200

Reexamination Certificate

active

07976928

ABSTRACT:
An annular mount base11continuously protruded from one face of a panel main body3and surrounding a through hole9has a dual structure of an inner mount base portion17and an outer mount base portion19which are joined to each other by four parts of a joint mount base portion21. A skin layer23is formed at the surface of a door inner panel1. An expanded layer25with a large number of pores is formed inside the panel main body3. The mount base11and a part of the panel main body3between the inner mount base portion17and the outer mount base portion19are formed of a solid layer27having no expanded layer25. Whereby, a lightweight resin molded article including a high-rigidity mount base is provided.

REFERENCES:
patent: 4446185 (1984-05-01), Waragai et al.
patent: 5437750 (1995-08-01), Rinse et al.
patent: 6488871 (2002-12-01), Nomura et al.
patent: 7223458 (2007-05-01), Tango
patent: 2796674 (2001-01-01), None
patent: 57-150554 (1982-09-01), None
patent: 11-156881 (1999-06-01), None
patent: 11-179751 (1999-07-01), None
patent: 2005-138805 (2005-06-01), None
patent: WO 2004092597 (2004-10-01), None
European Search Report dated Jun. 17, 2009; Application No./Patent No. 06731186.0-1253/1908566 PCT/JP2006307238.

Affiliated with

Also associated with

Rating

Resin molded article and molding method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin molded article and molding method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin molded article and molding method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2728456