Resin-metal compound complex

Details Resin-metal compound complex Resin-metal compound complex

1978-12-04

1980-07-08

Lone, Werren B.

Organic compounds -- part of the class 532-570 series

Organic compounds

Carboxylic acid esters

252431R, C07C 6705, B01J 3112

Patent

active

042118808

ABSTRACT:
This specification discloses an insoluble resin-metal compound complex, the method for its preparation, and its use in carrying out a catalyzed reaction. The complex is a weak base anion exchange resin which has been contacted with a solution of a coordination compound having at least two ligands connected to at least one central metal atom to bond chemically the resin to the metal atom by replacement of at least one of the ligands of the coordination compound by a functional group of the weak base anion exchange resin. The complex can be used as a catalyst for hydrogenation, carbon monoxide insertion, polymerization, isomerization, vinyl ester exchange, and ethylene oxidation reactions, among others.

REFERENCES:
patent: 2683124 (1954-07-01), D'Alelio
patent: 2779781 (1957-01-01), Copelin et al.
patent: 3280096 (1966-10-01), MacKennis
patent: 3288725 (1966-11-01), Aftandilian
patent: 3417066 (1966-12-01), Corte et al.
patent: 3442924 (1969-05-01), Imura et al.
patent: 3442954 (1969-05-01), Crocker et al.
patent: 3646115 (1972-02-01), Starr
patent: 3824221 (1974-07-01), Raggs
patent: 4145486 (1979-03-01), Haag
Herber et al., J. Amer. Chem. Soc., vol. 76 (1954), pp. 987-991.
Moore et al., J. Amer. Chem. Soc., vol. 72 (1950), pp. 5792-5793.
Nachord et al., "Ion Exchange Technology," (1956), pp. 292-297, Aca. Press., N.Y., N.Y.

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