Resin insulated type semiconductor device

Details Resin insulated type semiconductor device Resin insulated type semiconductor device

1990-11-28

1991-08-06

Sikes, William L.

H01L 2302

Patent

active

050382004

ABSTRACT:
An electrically-insulated type semiconductor device to be resin-moulded has a rear surface which can be set in direct contact with a heat radiation section and a front surface opposite to the rear surface. This semiconductor device includes a metal lead frame having a tip end portion sandwiched between the resin rear surface and resin front surface and a mounting portion on which a semiconductor chip is mounted, and frame supporting holes formed to penetrate from the resin front surface to the mounting portion of the lead frame. The frame supporting holes are formed by supporting pins for positioning the mounting portion of the lead frame. The frame supporting holes are formed only in the resin front surface, and the lead frame is formed in such a shape that a thickness of resin mould existing between the resin rear surface and the tip end portion of the lead frame is set to be larger than a thickness of resin mould existing between the resin rear surface and the mounting portion of the lead frame.

REFERENCES:
patent: 4750030 (1988-06-01), Hatakeyama
Patent Abstracts of Japan, vol. 10, No. 184 (E-415) [2240], Jun. 27, 1986.
Patent Abstracts of Japan, vol. 10, No. 268 (E-436) [2324], Sep. 12, 1986.
Patent Abstracts of Japan, vol. 11, No. 41 (E-478) [2488], Feb. 6, 1987.

Affiliated with

Also associated with

Rating

Resin insulated type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin insulated type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin insulated type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1990920