Resin impregnated laminate for wiring board applications

Details Resin impregnated laminate for wiring board applications Resin impregnated laminate for wiring board applications

1993-03-31

1994-05-24

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428286, 428287, 428290, 361750, B33B 1700

Patent

active

053147421

ABSTRACT:
Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

REFERENCES:
patent: 4729921 (1988-03-01), Tokarsky
patent: 4751146 (1988-06-01), Maeda et al.
patent: 5049435 (1991-12-01), Uno et al.

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