Resin forming mold and production method for the resin...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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Details

C428S652000, C428S610000, C428S680000, C428S336000, C427S250000, C205S070000, C205S186000, C216S041000

Reexamination Certificate

active

10542053

ABSTRACT:
The present invention is to provide a resin-forming mold having high releasability and permitting a production without increasing production costs. The resin-forming mold can be used to produce a resin-molded product having minute uneven portions on a front face thereof, such as a surface light source device-use light guide for a liquid crystal display, an aspherical micro-lens, micro-Fresnel lens and an optical disk. In the stamper (resin-forming mold)10provided with an electroformed layer11and a conductive film12formed on the electroformed layer11, the front face layer12cof the conductive film12is formed of aluminum and a back face12dis formed of nickel as an electroconductive metal. In addition, the constituent composition of the aluminum and the nickel continuously changes from the front face12ctoward the back face12d. The front face12cmay be formed of aluminum and oxygen. The aluminum may combine with the oxygen to form an oxide of aluminum.

REFERENCES:
patent: 6706465 (2004-03-01), Sano
patent: 07-003470 (1995-01-01), None
patent: 10-308040 (1998-11-01), None
patent: 11-039730 (1999-02-01), None
patent: 2003-025335 (2003-01-01), None

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