Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From silicon reactant having at least one...
Reexamination Certificate
2008-11-25
2011-10-11
Choi, Ling (Department: 1763)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From silicon reactant having at least one...
C257S100000, C257SE33059, C528S024000, C528S025000
Reexamination Certificate
active
08034889
ABSTRACT:
The present invention relates to a resin for optical-semiconductor-element encapsulation obtained by reacting a silicon compound with a boron compound or an aluminum compound, wherein the silicon compound is represented by the following formula (I):wherein R1and R2each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250, and an optical semiconductor device obtained with the resin.
REFERENCES:
patent: 3413242 (1968-11-01), Roberts et al.
patent: 5614654 (1997-03-01), Miyake et al.
patent: 2003/0216537 (2003-11-01), Friedrich
patent: 2006/0035092 (2006-02-01), Shimizu et al.
patent: 2006/0270786 (2006-11-01), Shimizu
patent: 2719091 (1978-01-01), None
patent: 3920297 (1991-01-01), None
patent: 0263428 (1988-04-01), None
patent: 0358011 (1990-03-01), None
patent: 0947520 (1999-10-01), None
patent: 1130053 (2001-09-01), None
patent: 1684363 (2006-07-01), None
patent: 1479475 (1977-07-01), None
patent: 8-120084 (1996-05-01), None
patent: 8-268735 (1996-10-01), None
patent: 08268735 (1996-10-01), None
patent: 9-48787 (1997-02-01), None
patent: 10-95852 (1998-04-01), None
patent: 11-246661 (1999-09-01), None
patent: 2003-165841 (2003-06-01), None
patent: 2006-77234 (2006-03-01), None
patent: 2006-274249 (2006-10-01), None
patent: 2006-328315 (2006-12-01), None
patent: 2008-231403 (2008-10-01), None
Notice of Reasons for Rejection dated Apr. 23, 2010, issued in counterpart Japanese Application No. 2007-306817.
Extended European Search Report dated Mar. 23, 2009.
Office Action issued on Apr. 20, 2011 in the corresponding European Patent Application No. 08020392.0.
Korean Office Action issued on Jul. 26, 2011 in the corresponding Korean Patent Application No. 10-2008-118802.
Katayama Hiroyuki
Kubo Asami
Choi Ling
Nitto Denko Corporation
Sughrue & Mion, PLLC
Wang Chun-Cheng
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