Resin flow and curing measuring device

Plastic article or earthenware shaping or treating: apparatus – With indicator – signal – recorder – illuminator – or inspection... – For molding temperature or pressure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

73 5409, 264 401, 425149, 425171, 425544, B29C 4576, B29C 4792, G01N 1104

Patent

active

051258218

ABSTRACT:
A measuring device for enabling an evaluation of a moldability of a thermosetting resin by determination of parameters suitable for high accuracy forecasting of flow and curing behaviors of the thermosetting resin within a metal mold, as well as a metal mold for molding a thermosetting resin and method for constructing runners of the metal mold which is effective to minimize if not prevent the occurrence of false in moldings. By utilizing unique or peculiar parameters of the thermosetting resin which are not influenced by a molding condition and by conducting a flow simulation with a metal mold having a flow passage of arbitrary dimensions using the determined values for the parameters, a forecasting of a flow in an actual metal mold is enabled so as to preselect optimum molding conditions and flow passage dimensions for a metal mold.

REFERENCES:
patent: 3033021 (1962-05-01), Dickason
patent: 3579799 (1971-05-01), Furstenberg
patent: 4240996 (1980-12-01), Hunkar
patent: 4241602 (1980-12-01), Han et al.
patent: 4678420 (1987-07-01), Inoue
patent: 4743190 (1988-05-01), Brunnschweiler et al.
patent: 4774675 (1988-09-01), Kagawa
patent: 4850217 (1989-07-01), Nunn
patent: 4875363 (1989-10-01), Hinduja et al.
Saeki et al, "Simulation of Balanced Filling in a Multi-Cavity Mold for Encapsulation of Semiconductor Devices", 4th Annual International Polymer Processing Society Meeting, May 1988.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resin flow and curing measuring device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin flow and curing measuring device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin flow and curing measuring device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1860061

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.