Resin film and multilayer printed wiring board using thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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Details

C523S467000, C525S107000, C525S109000, C525S113000, C525S114000, C525S120000, C525S122000, C525S438000, C525S452000, C525S481000, C525S497000, C525S502000, C525S504000, C525S508000, C525S510000, C525S523000, C174S258000

Reexamination Certificate

active

07087664

ABSTRACT:
A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

REFERENCES:
patent: 5641997 (1997-06-01), Ohta et al.
patent: 6410145 (2002-06-01), Hayashi et al.
patent: 6573016 (2003-06-01), Kami et al.
patent: 07-33991 (1995-02-01), None
patent: 07-34048 (1995-02-01), None
patent: 11-35916 (1999-02-01), None
patent: 11-100562 (1999-04-01), None
patent: 2001-72834 (2001-03-01), None

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