Resin filling apparatus, filling method, and method of...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock...

Reexamination Certificate

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Reexamination Certificate

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07955065

ABSTRACT:
A resin filling apparatus, a filling method, and a method of manufacturing an electronic device fill a cavity between a substrate and an electronic component mounted on the substrate with resin. The resin filling apparatus includes a stage for supporting the substrate in an inclined state, and an application head for filling the cavity with resin from a lower side of the inclined substrate.

REFERENCES:
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patent: 2794756 (1957-06-01), Leverenz
patent: 3137750 (1964-06-01), Gringras
patent: 3309450 (1967-03-01), Rodgers
patent: 5364584 (1994-11-01), Imanara et al.
patent: 2002/0115237 (2002-08-01), Williams
patent: 2002/0185748 (2002-12-01), Akram et al.
patent: 2005/0253281 (2005-11-01), Odegard et al.
patent: 08306717 (1996-11-01), None
patent: 9232347 (1997-09-01), None
patent: 2005193262 (2005-07-01), None

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