Resin-Filler composite and production method thereof

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

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524430, 524437, 524493, C08K 300

Patent

active

059902221

ABSTRACT:
The present invention relates to a composite of resin and fillers used in electronic parts and structural parts, and to a process for producing the same, and the object of the present invention is to provide a resin composite with a molded body having high dimensional accuracy, being free of surface defects attributable to a mold used for molding and being capable of easy forming and mass production, as well as a process for producing the same. The process for producing a resin composite according to the present invention comprises a step of mixing fillers of an average particle diameter of 40 .mu.m or less with thermosetting resin, a step of compression molding this mixed powder into a predetermined shape at ordinary temperature, and a step of allowing the compression molded body after released from the mold to be hardened by heating at 100 to 250.degree. C. to give a hardened molded body.

REFERENCES:
patent: 4711916 (1987-12-01), Hagiwara et al.
patent: 4766162 (1988-08-01), Hammamoto et al.

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