Resin-encased microelectronic module

Details Resin-encased microelectronic module Resin-encased microelectronic module

1974-09-23

1977-06-28

Reynolds, Bruce A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 52FP, H05K 506

Patent

active

040327060

ABSTRACT:
A metal plate carrying a semiconductive chip is encased in a prismatic resinous body having five tongues projecting from one side thereof, the central tongue being grounded to the plate while the other four are attached to various terminals of the chip. The projecting portions of the five tongues are alternately bent angularly in opposite directions to increase the separation of their free ends. During assembly, a connector strip bearing a number of five-tongue groups is fitted onto a support strip divided into as many plate sections, by inserting a bent-over extremity of the central tongue of each group, provided with an enlarged head, into a recess of a confronting plate section preparatorily to encasement.

REFERENCES:
patent: 3368114 (1968-02-01), Campbell et al.
patent: 3416348 (1968-12-01), Carter, Jr. et al.
patent: 3478420 (1969-11-01), Grimes et al.
patent: 3606673 (1971-09-01), Overman
patent: 3629672 (1971-12-01), VAN DE Water
patent: 3839782 (1974-10-01), Lincoln

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