Resin encapsulation type semiconductor device by use of epoxy re

Details Resin encapsulation type semiconductor device by use of epoxy re Resin encapsulation type semiconductor device by use of epoxy re

1985-05-31

1987-12-01

James, Andrew J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523460, H01L 2328

Patent

active

047107960

ABSTRACT:
A resin encapsulation type semiconductor device having a semiconductor element and a resinous encapsulating material for encapsulating said semiconductor element therein, said resinous encapsulating material comprising a cured product of an epoxy resin composition for encapsulation of semiconductor, comprising:

REFERENCES:
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4282136 (1981-08-01), Hunt et al.
patent: 4328150 (1982-05-01), Kondow et al.
patent: 4572853 (1986-02-01), Ikeya et al.

Affiliated with

Also associated with

Rating

Resin encapsulation type semiconductor device by use of epoxy re does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin encapsulation type semiconductor device by use of epoxy re, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin encapsulation type semiconductor device by use of epoxy re will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1934348