Resin encapsulation type semiconductor device

Details Resin encapsulation type semiconductor device Resin encapsulation type semiconductor device

1983-03-28

1986-10-14

Thomas, Alexander S.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

428 76, 525485, H01L 2330

Patent

active

046175849

ABSTRACT:
There is disclosed a highly reliable resin encapsulation type semiconductor device excellent humidity resistance as well as high temperature electric characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises a novolac type epoxy resin, a novolac type phenol resin, an organic phosphine compound and an organic phosphorus acid compound.
The resin encapsulation type semiconductor device is markedly small in leak current under hot an humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.

REFERENCES:
patent: 3998789 (1976-12-01), Yoshioka
patent: 4328150 (1982-05-01), Kondow et al.
Lee et al, "Non-Carboxylic Acid Curing Agents", Handbook of Epoxy Resins, 1967, Chapter 11, pp. 16-17.
Patents Abstracts of Japan, vol. 7, No. 8 (E-152) (1153), Jan. 13, 1983.

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