Resin encapsulation type semiconductor device

Details Resin encapsulation type semiconductor device Resin encapsulation type semiconductor device

1993-03-08

1994-09-13

Thomas, Alexander S.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

174 522, 257789, 257793, C08G 5932

Patent

active

053467434

ABSTRACT:
According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components:

REFERENCES:
patent: 4816496 (1989-03-01), Wada et al.
patent: 5001174 (1991-03-01), Yanagisawa et al.

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