Resin encapsulation system

Details Resin encapsulation system Resin encapsulation system

2005-06-21

2005-06-21

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

C425S121000, C425S125000, C425S215000, C425S544000, C425S575000, C425S453000

Reexamination Certificate

active

06908293

ABSTRACT:
In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.

REFERENCES:
patent: 5484274 (1996-01-01), Neu
patent: 5654017 (1997-08-01), Harmsen
patent: 6050802 (2000-04-01), Kobayashi
patent: 62150834 (1987-07-01), None
patent: H03-91937 (1991-04-01), None
patent: 06-314717 (1994-11-01), None
patent: 7-32414 (1995-02-01), None
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patent: 9-48041 (1997-02-01), None
patent: 09076276 (1997-03-01), None
patent: 09-153506 (1997-06-01), None
patent: 10189624 (1998-07-01), None
patent: H11-286022 (1999-10-01), None
Partial translation of JP09048041A obtained from the JPO website, the date of the reference is Feb. 18, 1997.

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