Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock...
Reexamination Certificate
2000-02-14
2004-10-19
Davis, Robert B. (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
C425S218000, C425S447000, C438S127000, C264S272170
Reexamination Certificate
active
06805541
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATION
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 11-035464, filed Feb. 15, 1999, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor manufacturing apparatus used in an assembling step of a semiconductor device and method for manufacturing a semiconductor device and, in particular, to a resin encapsulating apparatus for forming a resin sealing body on a semiconductor chip and resin encapsulating method using the resin encapsulating apparatus.
As a package structure of a semiconductor device there are known a ceramics package sealing a chip-like semiconductor substrate with semiconductor elements, such as a semiconductor circuit formed thereon, with the use of a ceramics container made of, for example, alumina, a resin encapsulated package with a resin sealing body formed by a transfer molding method, etc., and a TCP (tape carrier package) package, etc., formed by dropwise supplying a liquid-like resin to a chip-to-lead connection portion on a semiconductor chip (hereinafter referred to as a chip) with the use of a TAB (tape automated bonding) system. As a method for coating a resin sealing body on such a connection portion, there are the above-mentioned method for forming a package by dropwise supplying a given amount of liquid-like resin on such a portion and curing it and a method, etc., of printing a liquid-like resin of a given viscosity on a connection portion with the use of a mask.
The conventional resign encapsulating apparatus for manufacturing the semiconductor device will be explained below with reference to
FIGS. 1 and 2
.
FIG. 1
is a perspective view showing a resin encapsulating apparatus for sealing a resin with the use of a given amount extruding method.
The resin encapsulating apparatus using such a given amount extruding method of
FIG. 1
has the following structure. A resin
1
, such as an epoxy, having a viscosity is contained within a cylinder
2
. This cylinder
2
is mounted on the cylinder holder
3
. The cylinder holder
3
is arranged on an XYZ drive section
4
movable in XYZ directions (horizontal and vertical directions). The cylinder
2
is connected to a given quantity extruding device
6
via an air tube
5
. An air pressure control mechanism is provided at the given quantity extruding device
6
. By the air pressure control mechanism, the liquid-like resin
1
of an amount necessary to the sealing operation is extruded from the forward end of the cylinder
2
and coated on a target member (here, a semiconductor chip mounted on a tape carrier).
At the resin encapsulating apparatus, a conveying section
8
is provided for setting a tape carrier
7
to a predetermined position and the liquid-like resin
1
is coated. For example, the tape carrier
7
is conveyed to a predetermined position. Further, the tape carrier
7
is positioned by a positioning block
9
and fixed in place. The cylinder
2
is moved by the XYZ drive section
4
to a coating position on the tape carrier
7
. While moving the cylinder
2
in accordance with an initially registered pattern, a given amount of liquid-like resin
1
is coated on the tape carrier
7
. By doing so, a predetermined portion of the chip is sealed.
FIG. 2
is a perspective view showing a resin encapsulating apparatus for performing resin sealing by a printing method. The resin encapsulating apparatus using a printing method as shown in
FIG. 2
includes a conveying section
11
, positioning fixing block
12
, mask
13
, squeegee
16
, up/down drive section
17
and X, Y direction drive section
18
. A tape carrier
10
with a chip mounted thereon is conveyed by the conveying section
11
to a predetermined position. Further, the tape carrier
10
is positioned by a positioning fixing block
12
and fixed in place. The fixed tape carrier
10
is moved by the block drive section (not shown) to a predetermined position and, after being lifted, pushed against the mask
13
set over the conveying section
11
.
An opening
14
is provided in the mask to correspond to a coating position. A resin
15
of a given viscosity is placed on a predetermined position of the mask
13
. The squeegee
16
placed over the mask
13
is moved by the up/down drive section
17
to a position contacting with the mask
13
and further moved by the drive section
18
(moved in the X direction in this case-or in the Y direction) in the X direction (or the Y direction) over the opening
14
of the mask
13
. At this time, since a resin
15
is initially extruded on a position between the down position of the squeegee
16
and the opening
14
, the resin
15
is filled in the opening
14
by the above-mentioned operation. By doing so, a predetermined portion of the chip is sealed.
These methods have the following problems. In the given quantity extruding method, since the liquid-like resin serving as a resin sealing body for the chip has a considerable high viscosity, it is not possible to control the spreading, etc., of the resin at a time of coating. As a result, there is a problem that a horizontal accuracy of the resin in the horizontal direction (X, Y directions) is lowered. This method is directed to dropwise supplying a given amount of liquid-like resin to a predetermined position to allow it to be spread in its own natural way, thus posing a problem that the thickness of the resin sealing body never becomes uniform and a defective product is produced due to variation, etc., in sealing thickness of the resin.
In the printing system, a given amount of resin (
15
) is deposited on the mask
13
and, through a repeated printing operation, only a given amount of resin is extruded onto the mask
13
when that amount of resin is lowered. As a result, there occurs a variation in viscosity of the resin, no complete filling of the resin in a filling site occurs, sometimes leaving no resin-filled area. This method takes more resin at a time of finishing the operation and more product costs.
FIGS. 3A
to
3
D are cross-sectional views showing a resin coating section of a semiconductor device in the printing method using the resin encapsulating apparatus shown in FIG.
2
. As shown in
FIG. 3A
, the tape carrier
10
with a chip
70
mounted thereon is placed on the positioning fixing block
12
. The mask
13
having the opening
14
is set on the tape carrier
10
. In this state, the resin
15
of a viscous nature is extruded on the mask
13
. And the resin
15
is held by the squeegee
16
and, as shown in
FIGS. 3B and 3C
, the squeegee
16
is moved along the plane of the opening
14
. By doing so, the resin
15
is buried in the opening
14
. In the case where the resin
15
was so buried by the above-mentioned method, it follows that, since the resin
15
is relatively high in viscosity, it is not fully filled at the corners of the bottom of the opening
14
. This poses a problem of producing a defective semiconductor device. Such a problem becomes prominent in a semiconductor device of such a type that the protective resin sealing body and balls for external connection are provided on the same surface side.
BRIEF SUMMARY OF THE INVENTION
The present invention is achieved to solve the above-mentioned task and is directed to providing a resin encapsulating apparatus and method which can enhance dimensional accuracy of a resin sealing body formed on a semiconductor device and prominently reduce occurrence of defective products resulting from an insufficient filling of resin and use the resin very effectively.
In a first aspect of the present invention, there is provided a resin encapsulating apparatus comprising a retaining section for retaining a semiconductor device, a mask set on the semiconductor device and having an opening at which part of the semiconductor device is exposed, an extruding section for extruding a fluidizing resin into the opening of the mask, a first drive section for driving the extruding section, a squeegee for cau
Davis Robert B.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
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