Resin encapsulating apparatus for semiconductor devices

Details Resin encapsulating apparatus for semiconductor devices Resin encapsulating apparatus for semiconductor devices

1989-03-13

1991-01-08

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427211, 26427217, 425121, 425544, 425588, 437207, B29C 4502, B29C 4514, B29C 4532, B29L 3134

Patent

active

049831100

ABSTRACT:
A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.

REFERENCES:
patent: 4554126 (1985-11-01), Sera
patent: 4767302 (1988-08-01), Okamoto et al.
patent: 4900501 (1990-02-01), Saeki et al.

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