Resin-encapsulated type semiconductor packages, and...

Details Resin-encapsulated type semiconductor packages, and... Resin-encapsulated type semiconductor packages, and...

2008-03-25

2008-03-25

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257SE21502

Reexamination Certificate

active

10556144

ABSTRACT:
The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to a compression plunger inside a cavity of a lower molding unit, a semiconductor package is molded by encapsulating under pressurizing with the compression plunger.Even when the wires are thinned and arranged at a higher density, the above producing method can provide such method and apparatus for producing the resin-encapsulated type semiconductor packages that produce less flowing of the wires.

REFERENCES:
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patent: A 2004-296962 (2004-10-01), None

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