Resin-encapsulated semiconductor devices

Details Resin-encapsulated semiconductor devices Resin-encapsulated semiconductor devices

1989-09-08

1991-01-15

James, Andrew J.

357 80, H01L 2328

Patent

active

049857517

ABSTRACT:
A resin-encapsulated semiconductor device is of the structure wherein a silicon chip on a die pad is encapsulated with a molding resin. The rear surface of the die pad remote from the silicon chip, preferably the entire surfaces of the elements are treated with a primer, typically a silane coupling agent and a low stress epoxy resin encapsulant is used, preventing the encapsulating resin from separating and cracking upon subsequent dipping in solder bath.

REFERENCES:
patent: 4529755 (1985-07-01), Nishikawa et al.

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