Resin-encapsulated semiconductor device producing apparatus and

Details Resin-encapsulated semiconductor device producing apparatus and Resin-encapsulated semiconductor device producing apparatus and

1999-12-02

2000-07-04

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

438112, 438113, 438127, 26427213, H01L 2100, H01L 2164, H01L 2144, H01L 2148, H01L 2150

Patent

active

060819782

ABSTRACT:
A resin-encapsulated semiconductor device producing apparatus includes resin encapsulating part for encapsulating, into a unitary structure, a semiconductor-chip holding zone of a lead frame or a substrate which holds a semiconductor chip, this encapsulation being made with an encapsulating resin material. The resin encapsulating part has first and second holding members for holding the lead frame or the substrate such that the first and second holding members are opposite to each other through the lead frame or the substrate. At least one of the first and second holding members has a housing concave formed opposite to the holding zone, the housing concave being capable of housing the encapsulating resin material. A resin thickness regulating member for regulating the thickness of the encapsulating resin material is removably disposed on the bottom of the housing concave.

REFERENCES:
patent: 5336272 (1994-08-01), Tsutsumi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6033933 (2000-03-01), Hur

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