Resin-encapsulated semiconductor device package with nonconducti

Details Resin-encapsulated semiconductor device package with nonconducti Resin-encapsulated semiconductor device package with nonconducti

1990-10-04

1993-01-05

James, Andrew J.

357 74, 357 72, H01L 2944, H01L 2348, H01L 2952, H01L 2960

Patent

active

051763664

ABSTRACT:
A semiconductor device in which outer leads adjoining in the direction of arrangement of said outer leads are connected by an insulating material with a predetermined width, locally provided only in the areas with said predetermined width along said direction of arrangement, and in which areas other than said outer leads and said insulating material are resin-sealed. A method for manufacturing a semiconductor device, which has the steps of connecting adjacent outer leads, with an insulating material with a predetermined width locally provided only in areas with said predetermined width along the direction of arrangement of outer leads, and of resin-sealing areas other than said outer leads and said insulating material while preventing the outflow of sealing resin by way of said insulating material.

REFERENCES:
patent: 4916522 (1990-04-01), Cohn

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