Resin-encapsulated semiconductor device

Details Resin-encapsulated semiconductor device Resin-encapsulated semiconductor device

1988-05-27

1990-08-21

Davie, James W.

357 70, H01L 2348

Patent

active

049511220

ABSTRACT:
The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.

REFERENCES:
patent: 4803543 (1989-02-01), Imayoshi et al.
patent: 4884124 (1989-11-01), Mori et al.

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