Resin encapsulated semiconductor device

Details Resin encapsulated semiconductor device Resin encapsulated semiconductor device

1988-08-02

1990-10-23

James, Andrew J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525481, 525527, H01L 2328

Patent

active

049656570

ABSTRACT:
A resin encapsulated semiconductor device sealed with an epoxy resin molding material particularly containing a brominated epoxy resin as a flame retardant with the bromine content of 0.5% by weight or less, antimony oxide as a flame retardant in an amount of 2.0% by weight or more and a quaternary phosphonium tetrasubstituted borate as a curing accelerator is excellent in connection reliability at Au/Al junctions and heat resistance.

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patent: 3378434 (1968-04-01), Harrington
patent: 4282136 (1981-05-01), Hunt et al.
patent: 4550129 (1985-10-01), Nir, Sr.
patent: 4710796 (1957-12-01), Ikeya et al.
patent: 4873309 (1989-10-01), Corley
Windell et al, `Plastic Outgassing Induced Wire Bond Failure,` Proceedings of the 27th Electronic Components Conference, (1977).
22nd Annual Proceedings Reliability Physics, pp. 37-47 (1984).
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-9, No. 4, pp. 379-385 (1986).
25th Annual Proceedings Reliability Physics, pp. 28-33 (1987).

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