Resin encapsulated semiconductor device

Details Resin encapsulated semiconductor device Resin encapsulated semiconductor device

1981-05-22

1988-07-19

Carroll, J.

357 71, 357 54, 357 52, H01L 2348, H01L 2328, H01L 2934

Patent

active

047588756

ABSTRACT:
Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the aromatic polyimide polymer having a saturated water absorption rate of 1% or less. The polyimide polymer is exemplified as the polymer having the following recurring units: ##STR1## wherein R is an aliphatic or aromatic group; R.sub.1 and R.sub.2 are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or CF.sub.3 ; and R.sub.3 to R.sub.6 are independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. The disclosure is also concerned with resin encapsulated semiconductor devices in which the aromatic polyimide polymer of low water absorption is used as an insulating layer or passivation film.

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W. C. Ward, "Alpha Particle Shield", IBM Technical Disclosure Bulletin, vol. 22 (1979), p. 1398.

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