Resin-encapsulated semiconductor device

Details Resin-encapsulated semiconductor device Resin-encapsulated semiconductor device

1987-08-17

1989-11-28

Hille, Rolf

357 70, H01L 2328

Patent

active

048841242

ABSTRACT:
A semiconductor device comprises a semiconductor element which is bonded to a flat base and encapsulated in a resin. The base has a bonding section at its center to which the semiconductor element is bonded, the area of the bonding section being smaller than that of the bottom surface of the semiconductor element. The portion of the base outside the bonding section has a plurality of through holes or depressions formed in its top and bottom surfaces which increase the adhesion between the resin and the base. The bonding section may be substantially separated from the remainder of the base by elongated through holes or depressions which substantially surround the bonding section.

REFERENCES:
patent: 4268848 (1981-05-01), Caset et al.
patent: 4604642 (1986-08-01), Sakurai

Affiliated with

Also associated with

Rating

Resin-encapsulated semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin-encapsulated semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin-encapsulated semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-585440