Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-12-11
2007-12-11
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S737000, C257S676000
Reexamination Certificate
active
11362784
ABSTRACT:
A resin-encapsulated package includes a semiconductor IC chip, wherein the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package. The resin-encapsulated package includes a semiconductor IC chip sealed in a resin molding, and a lead member having an arrangement of a plurality of discrete terminal sections. Each terminal section has inner terminal parts to be electrically connected to terminals of the semiconductor IC chip, outer terminal parts to be connected to external circuits, and connecting parts interconnecting the inner and the outer terminal parts. The contact surfaces of the inner terminal parts and the outer terminal parts face toward opposite directions, respectively. The contact surfaces of the inner terminal parts of the terminal sections are flush with each other.
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Clark S. V.
Dai Nippon Printing Co. Ltd.
Oliff & Berridg,e PLC
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