Resin encapsulated electronic devices

Details Resin encapsulated electronic devices Resin encapsulated electronic devices

1988-02-01

1990-06-12

Carroll, J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 73, 174 522, H01L 2328, H01L 2330

Patent

active

049337440

ABSTRACT:
Resin encapsulated electronic devices are provided by encapsulating so-called flat-shaped, plate-like, or angular-shaped electronic devices with a resin composition containing rubber-like particles preferably having an average particle size of 150 .mu.m or less. In the course of production of said resin encapsulated electronic devices, no crack is produced in the electronic devices by the stress from the outside, and after production, said resin encapsulated electronic devices are amazingly lessened in formation of cracks by thermal stress and have high reliability.

REFERENCES:
patent: 4001655 (1977-01-01), Voyles et al.
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 4042955 (1977-08-01), Imai et al.
patent: 4047075 (1977-09-01), Schoberl
patent: 4092487 (1978-05-01), Imai
patent: 4220962 (1980-09-01), Sommer et al.
patent: 4327369 (1982-04-01), Kaplan
patent: 4529755 (1985-07-01), Nishikawa et al.
E. H. Rowe et al., "Toughening Thermosets with Liquid Butadiene/Acrylonitrile Polymers", Modern Plastics, Aug. 1970, pp. 110-117.

Affiliated with

Also associated with

Rating

Resin encapsulated electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin encapsulated electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin encapsulated electronic devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-621233