Resin compositions for sealing semiconductor

Details Resin compositions for sealing semiconductor Resin compositions for sealing semiconductor

1989-09-01

1992-06-09

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

523427, 523435, 523466, 524588, C08F28300, C08F28312

Patent

active

051208032

ABSTRACT:
A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.

REFERENCES:
patent: 4904761 (1990-02-01), Okitsu et al.

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