Resin compositions for sealants and films

Details Resin compositions for sealants and films Resin compositions for sealants and films

2005-05-17

2005-05-17

Nolan-Rayford, Sandra M. (Department: 1772)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

C525S191000, C525S197000, C525S240000

Reexamination Certificate

active

06893715

ABSTRACT:
A composition for sealants and films comprising polymers (A-b), (B-b) and from 0 to 50% by weight (C-b) is taught. Polymer (A-b) contains 10 to 70% by weight of an ethylene/α-olefin polymer having a α-olefin content of 7 to 30 mol %, a density of 0.850 to 0.900 g/cm3and a melt flow rate (MFR-A), at 190° C., of 0.1 to 10 g/10 min. Polymer (B-b) contains 10 to 80 wt % propylene polymer with a melt flow rate (MFR-B), at 230° C., of 0.5 to 100 g/10 min. Polymer (C-b) contains an ethylene polymer having a density of 0.900 to 0.960 g/cm3. The ratio of MFR-B to MFR-A is 3 to 500.

REFERENCES:
patent: 5302442 (1994-04-01), O'Brien
patent: 5473016 (1995-12-01), Fujii et al.
patent: 6300415 (2001-10-01), Okayama et al.
patent: 6743523 (2004-06-01), Woo et al.
patent: WO 9317863 (1993-09-01), None
Patent Abstracts of Japan, Publication No. 07109389, Publication Date Apr. 25, 1995.

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