Resin compositions and printed circuit boards using the same

Details Resin compositions and printed circuit boards using the same Resin compositions and printed circuit boards using the same

1995-08-23

1996-12-31

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

361748, B32B 900

Patent

active

055892507

ABSTRACT:
A resin composition as well as a printed circuit board using the same are disclosed. The resin composition is formed by dispersing powder of a cured heat-resistant resin powder soluble in acid or oxidizing agent into a matrix of an uncured photosensitive resin hardly soluble in acid or oxidizing agent, in which a coloring matter is added to the resin matrix and/or the heat-resistant resin powder.

REFERENCES:
patent: 3873309 (1975-03-01), Goffe
patent: 3962520 (1976-06-01), Watanabe
patent: 4752499 (1988-06-01), Enomoto
patent: 5021472 (1991-06-01), Enomoto
patent: 5055321 (1991-10-01), Enomoto
patent: 5135717 (1992-08-01), Renzoni et al.
patent: 5344893 (1994-09-01), Asai
Benson et al., "Absorption of Fluorescence Properties of Cyanine Dyes", Journal of Chemical and Engineering Data, vol. 22, No. 4, 1977, pp. 379-383.
Patent Abstracts of Japan, vol. 16, No. 465 (E-1270), Sep. 28, 1992.
DATABASE WPI, Week 7916, Derwent Publications Ltd.., London GB; AN 79-30724B.
European Search Report and Annex.

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