Resin composition, prepreg, laminate, and semiconductor package

Details Resin composition, prepreg, laminate, and semiconductor package Resin composition, prepreg, laminate, and semiconductor package

2008-05-06

2008-05-06

Sanders, Kriellion A (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C428S331000, C427S285000, C427S287000

Reexamination Certificate

active

10789914

ABSTRACT:
A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure. A semiconductor package is manufactured by mounting an IC chip on a prepreg on which the metallic foil has been laminated.

REFERENCES:
patent: 4309473 (1982-01-01), Minamisawa et al.
patent: HEI 6-107958 (1994-04-01), None
patent: 2002020461 (2002-01-01), None
patent: 2002-105198 (2002-04-01), None
patent: 2002-114823 (2002-04-01), None
patent: 2002-114838 (2002-04-01), None
patent: 2002-117832 (2002-04-01), None
patent: 2002172736 (2002-06-01), None
patent: 2003206360 (2003-07-01), None
International Search Report for PCT/JP02/08845 published in WO 03/018675.
JPO computer generated translations for 2002-020461 and 2002-172736 and 2003-206360.
Communication from The European Patent Office regarding corresponding EP Application No. 02772828, Dec. 10, 2004.

Affiliated with

Also associated with

Rating

Resin composition, prepreg, laminate, and semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin composition, prepreg, laminate, and semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition, prepreg, laminate, and semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3932982