Resin composition, prepreg, laminate, and semiconductor package

Details Resin composition, prepreg, laminate, and semiconductor package Resin composition, prepreg, laminate, and semiconductor package

2008-05-06

2008-05-06

Sanders, Kriellion A (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C428S331000, C427S285000, C427S287000

Reexamination Certificate

active

07368497

ABSTRACT:
A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure. A semiconductor package is manufactured by mounting an IC chip on a prepreg on which the metallic foil has been laminated.

REFERENCES:
patent: 4309473 (1982-01-01), Minamisawa et al.
patent: HEI 6-107958 (1994-04-01), None
patent: 2002020461 (2002-01-01), None
patent: 2002-105198 (2002-04-01), None
patent: 2002-114823 (2002-04-01), None
patent: 2002-114838 (2002-04-01), None
patent: 2002-117832 (2002-04-01), None
patent: 2002172736 (2002-06-01), None
patent: 2003206360 (2003-07-01), None
International Search Report for PCT/JP02/08845 published in WO 03/018675.
JPO computer generated translations for 2002-020461 and 2002-172736 and 2003-206360.
Communication from The European Patent Office regarding corresponding EP Application No. 02772828, Dec. 10, 2004.

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