Resin composition, prepreg and metal-foil-clad laminate

Details Resin composition, prepreg and metal-foil-clad laminate Resin composition, prepreg and metal-foil-clad laminate

2007-02-23

2010-02-23

Feely, Michael J (Department: 1796)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S297400, C428S297700, C428S413000, C428S414000, C428S418000, C523S440000, C523S443000, C523S466000, C525S523000, C525S524000, C525S525000, C525S528000

Reexamination Certificate

active

07666509

ABSTRACT:
A resin composition excellent in heat resistance after moisture absorption, lead-free solder reflow properties, dimensional stability and electrical characteristics for high-multilayer and high-frequency-capable printed wiring boards, which composition comprises a bisphenol A type epoxy resin (a) having at least two epoxy groups per molecule and a secondary hydroxyl group amount of 0.4 meq/g or less, a novolak type epoxy resin (b) at least two epoxy groups per molecule, a cyanate ester resin (c) having at least two cyanate groups per molecule and spherical silica having an average particle diameter of 4 μm or less, wherein the equivalent ratio of cyanate groups/epoxy groups in the resin composition is in the range of 0.7 to 1.45, and a prepreg and a metal-foil-clad laminate each of which comprises the resin composition.

REFERENCES:
patent: 6469074 (2002-10-01), Hino et al.
patent: 2005/0129895 (2005-06-01), Nakamura

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