Resin composition, heat-resistant resin paste and...

Details Resin composition, heat-resistant resin paste and... Resin composition, heat-resistant resin paste and...

2006-06-13

2006-06-13

Woodward, Ana (Department: 1711)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C524S104000, C524S107000, C524S115000, C524S138000, C524S173000, C524S210000, C524S233000, C324S251000, C324S378000, C324S538000

Reexamination Certificate

active

07061081

ABSTRACT:
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

REFERENCES:
patent: 5037862 (1991-08-01), Nishizawa et al.
patent: 5087658 (1992-02-01), Nishizawa et al.
patent: 5164816 (1992-11-01), Nishizawa et al.
patent: 5374677 (1994-12-01), Nishio et al.
patent: 3287668 (1991-12-01), None
patent: 4285660 (1992-10-01), None
patent: 4285662 (1992-10-01), None

Affiliated with

Also associated with

Rating

Resin composition, heat-resistant resin paste and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin composition, heat-resistant resin paste and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition, heat-resistant resin paste and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3654786