Resin composition for sealing semiconductors

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

525534, 528 96, 528423, 528 98, 523466, C08F28300, C08G 828

Patent

active

051342049

ABSTRACT:
A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula: ##STR1## where R.sub.1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula: ##STR2## where n is a positive integer of 3-16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.

REFERENCES:
patent: 4277600 (1981-07-01), Mark et al.
patent: 4342852 (1982-08-01), Takeda et al.
patent: 4379728 (1983-04-01), Lin
patent: 4382128 (1983-05-01), Li
patent: 4579916 (1986-04-01), Schmid et al.
patent: 4888407 (1989-12-01), Yasuhisa et al.
patent: 4913697 (1990-04-01), Saito et al.
patent: 4960860 (1990-10-01), Saito et al.
patent: 4980436 (1990-12-01), Saito et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resin composition for sealing semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin composition for sealing semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for sealing semiconductors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1687696

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.