Resin composition for sealing semiconductors

Details Resin composition for sealing semiconductors Resin composition for sealing semiconductors

1988-11-22

1990-02-27

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525476, C08L 8304, C08L 6310, C08K 336

Patent

active

049047612

ABSTRACT:
A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.

REFERENCES:
patent: 3577263 (1971-05-01), Nordstrom
patent: 4663397 (1987-05-01), Morita et al.
patent: 4707529 (1987-11-01), Hoffman et al.

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