Resin composition for sealing optical device, cured product...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C528S016000, C528S017000, C528S018000, C528S043000

Reexamination Certificate

active

07550204

ABSTRACT:
The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104or greater, represented by an average composition formula:in-line-formulae description="In-line Formulae" end="lead"?R1a(OX)bSiO(4−a−b)/2in-line-formulae description="In-line Formulae" end="tail"?(wherein, R1represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4(wherein, REto R4are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.

REFERENCES:
patent: 5300610 (1994-04-01), Nakanishi et al.
patent: 2006/0035092 (2006-02-01), Shimizu et al.
patent: 2006/0229408 (2006-10-01), Shimizu et al.
patent: 2006/0270786 (2006-11-01), Shimizu et al.
patent: 1 223 192 (2002-07-01), None
patent: 10-139964 (1998-05-01), None
Machine translation of JP 10-139964, 1998 with accompanying full translation ofparagraphs [0022-24], [0031], [0035].
U.S. Appl. No. 11/773,143, filed Jul. 3, 2007, Shimizu, et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resin composition for sealing optical device, cured product... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin composition for sealing optical device, cured product..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for sealing optical device, cured product... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4149172

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.