Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate
2011-03-08
2011-03-08
Nhu, David (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
With means to control surface effects
Insulating coating
C257S079000, C257S088000, C257SE21006, C257SE21007, C257SE21053, C257SE21077, C257SE21136, C257SE21263, C257SE21264, C257SE21329
Reexamination Certificate
active
07902642
ABSTRACT:
A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, an aliphatic hydrocarbon including one or more epoxy groups and a cationic polymerization initiator. Furthermore, a lamp of the present invention includes a package equipped with a cup-shaped sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the above-described resin composition for sealing a light-emitting device filled in the sealing member.
REFERENCES:
patent: 2009/0062481 (2009-03-01), Ito et al.
patent: 2009/0137774 (2009-05-01), Ito
patent: 2009/0137775 (2009-05-01), Ito
patent: 2004-203943 (2004-07-01), None
patent: 2004-238589 (2004-08-01), None
patent: 2005-336349 (2005-12-01), None
patent: 2006-131848 (2006-05-01), None
patent: 2006-263929 (2006-10-01), None
patent: 2006-335985 (2006-12-01), None
patent: 2006-342276 (2006-12-01), None
patent: 2007-326988 (2007-12-01), None
Sakata Yuko
Takei Tomoyuki
Nhu David
Showa Denko K.K.
Sughrue & Mion, PLLC
LandOfFree
Resin composition for sealing light-emitting device and lamp does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition for sealing light-emitting device and lamp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for sealing light-emitting device and lamp will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2716400