Resin composition for sealing light-emitting device and lamp

Details Resin composition for sealing light-emitting device and lamp Resin composition for sealing light-emitting device and lamp

2011-03-08

2011-03-08

Zimmer, Marc S (Department: 1765)

Stock material or miscellaneous articles

Composite

Of silicon containing

C524S430000, C524S431000, C524S497000, C525S476000

Reexamination Certificate

active

07901785

ABSTRACT:
A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, a cationic polymerization initiator and a metal oxide fine particle. Furthermore, a lamp of the present invention includes a package equipped with a sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the resin composition for sealing a light-emitting device filled in the sealing member.

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Machine translation of JP2005-206787.

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