Resin composition for sealing electronic parts, and hydration-re

Details Resin composition for sealing electronic parts, and hydration-re Resin composition for sealing electronic parts, and hydration-re

1987-04-03

1988-08-23

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523457, 524433, C08K 322

Patent

active

047661623

ABSTRACT:
Disclosed is a resin composition for sealing electronic parts, which comprises a thermosetting resin and, incorporated therein, high-purity magnesium oxide. A hydration-resistant magnesia powder having the particle surfaces covered with a continuous and uniform coating of silica is advantageously used as the magnesium oxide. This hydration-resistant magnesia powder is prepared by introducing a heated vapor of an organic silicate compound into a reactor of a fluidized bed of magnesia powder heated at 100.degree. to 600.degree. C. so that the concentration of the organic silicate compound is 1 to 20 mole %, and precipitating a coating of silica on the surfaces of magnesia particles by thermal decomposition and/or hydrolysis of the organic silicate compound on the surfaces of magnesia particles.

REFERENCES:
patent: 3481896 (1969-12-01), Logan
patent: 3658750 (1972-04-01), Tsukui et al.
patent: 3755240 (1973-08-01), Lucker et al.
patent: 4677026 (1987-06-01), Hamamoto et al.

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