Resin composition for sealing electronic parts, and hydration-re

Details Resin composition for sealing electronic parts, and hydration-re Resin composition for sealing electronic parts, and hydration-re

1986-07-14

1987-06-30

Jacobs, Lewis T.

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

427213, 427215, 106306, B32B 900, B05D 700

Patent

active

046770267

ABSTRACT:
Disclosed is a resin composition for sealing electronic parts, which comprises a thermosetting resin and, incorporated therein, high-purity magnesium oxide. A hydration-resistant magnesia powder having the particle surfaces covered with a continuous and uniform coating of silica is advantageously used as the magnesium oxide. This hydration-resistant magnesia powder is prepared by introducing a heated vapor of an organic silicate compound into a reactor of a fluidized bed of magnesia powder heated at 100.degree. to 600.degree. C. so that the concentration of the organic silicate compound is 1 to 20 mole %, and precipitating a coating of silica on the surfaces of magnesia particles by thermal decomposition and/or hydrolysis of the organic silicate compound on the surfaces of magnesia particles.

REFERENCES:
patent: 3947373 (1976-03-01), Sobajima et al.
patent: 4547536 (1985-10-01), Nabors
patent: 4563488 (1986-01-01), Minami et al.
patent: 4585673 (1986-04-01), Sigai

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