Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Cellular products or processes of preparing a cellular...
Reexamination Certificate
2007-09-24
2011-10-18
Gulakowski, Randy (Department: 1766)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Cellular products or processes of preparing a cellular...
C521S142000, C526S348000, C526S160000
Reexamination Certificate
active
08039523
ABSTRACT:
A resin composition for pressure-foam molding, which comprises an ethylene-based copolymer and a foaming agent, wherein the ethylene-based copolymer has monomer units derived from ethylene and monomer units derived from an a-olefin having 3 to 20 carbon atoms, has a melt flow rate of 0.01 to 0.7 g/10 minutes, a molecular weight distribution of 5 or more determined by a gel permeation chromatography, an activation energy of flow of 40 kJ/mol or more, and inflection points of 3 or less on a melting curve within temperature range from 25° C. to the end point of melting obtained by a differential scanning calorimetry; a foam obtained by press foaming; and a process for producing the foam.
REFERENCES:
patent: 2004/0261297 (2004-12-01), Park
patent: 2007/0100106 (2007-05-01), Iseki et al.
patent: 3-2657 (1991-01-01), None
patent: B-302657 (1991-01-01), None
patent: 2005-314638 (2005-11-01), None
patent: 2005-314638 (2005-11-01), None
patent: A-2005-314638 (2005-11-01), None
Nagamatsu Tatsuhiro
Yamada Katsuhiro
Fitch Even Tabin & Flannery
Gulakowski Randy
Negrelli Kara
Sumitomo Chemical Company Limited
LandOfFree
Resin composition for press foaming, foam and process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition for press foaming, foam and process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for press foaming, foam and process for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4291148