Resin composition for mold used in forming micropattern, and...

Details Resin composition for mold used in forming micropattern, and... Resin composition for mold used in forming micropattern, and...

2004-04-14

2010-02-02

Tran, Thao T. (Department: 1794)

Stock material or miscellaneous articles

Composite

Of polyamidoester

C428S446000, C428S421000, C264S225000

Reexamination Certificate

active

07655307

ABSTRACT:
A resin composition for a mold used in forming micropatterns comprises (A) 40 to 90 parts by weight of an active energy curable urethane-based oligomer having a reactive group; (B) 10 to 60 parts by weight of a monomer reactive with the urethane-based oligomer, (C) 0.01 to 200 parts by weight of a silicone or fluorine containing compound, based on 100 parts of the sum of the components (A) and (B); and (D) 0.1 to 10 parts by weight of a photoinitiator, based on 100 parts of the sum of the components (A), (B) and (C). The inventive resin composition can be easily cured by the action of an active energy ray, and the organic mold fabricated therefrom is easily lifted off from a master without irreversible adhesion or generation of defects and have excellent dimensional and chemical stabilities.

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